31-MAY-2016

🕸 Report date: 31-MAY-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯Install label linear remover assembly
Progress: 60%
Current status: Design concept final stage. Pending fabrication.
Due date: 17-June-2016 (improvement plan-can buy off without this first)

🎯 MC not detect if temperature thermal release out of spec
Progress:0%
Current status: Pending software
Due date: TBA

🎯 Barcode installation &  system server (if fail OCR)
Progress: 10%
Current status: Need to manual key in using key board if OCR fail to read (but still have potiential for wrong input). Recommend Barcode scanner to install in order to ensure no failure (poka yoke)- 2nd priority
Current status: Under discussion with waftech group.

🎯 Close loop control system & verification
Progress:40%
Current status: Only pick&place, labeling, and robot arm verified. Others will continue check.
Due date: 7-June-2016


Overall progress to production mode: 83.5%

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WAFTECH#3 CU PILLAR UPDATE

🎯UV detaper not effective enough
Progress: 20%
Current status: Hardware designing stage.
Due date: 27 June 2016

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🎯 Today activity:
-Chuck table mounter vacuum leak. Change new tube-solved
-Bug checking: Error found at Thermal release- not detect carrier if vacuum out of spec.
-Buy off 3 wafer. OK, no error/reject found.

Note:
Buy off 3 wafer: 10 min 38 sec - No issue
Now pending verified all close loop system with Software Engineer.
Jacky software, pls come tomorrow