31-MAY-2016

🕸 Report date: 31-MAY-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯Install label linear remover assembly
Progress: 60%
Current status: Design concept final stage. Pending fabrication.
Due date: 17-June-2016 (improvement plan-can buy off without this first)

🎯 MC not detect if temperature thermal release out of spec
Progress:0%
Current status: Pending software
Due date: TBA

🎯 Barcode installation &  system server (if fail OCR)
Progress: 10%
Current status: Need to manual key in using key board if OCR fail to read (but still have potiential for wrong input). Recommend Barcode scanner to install in order to ensure no failure (poka yoke)- 2nd priority
Current status: Under discussion with waftech group.

🎯 Close loop control system & verification
Progress:40%
Current status: Only pick&place, labeling, and robot arm verified. Others will continue check.
Due date: 7-June-2016


Overall progress to production mode: 83.5%

➖➖➖➖➖➖➖➖

WAFTECH#3 CU PILLAR UPDATE

🎯UV detaper not effective enough
Progress: 20%
Current status: Hardware designing stage.
Due date: 27 June 2016

➖➖➖➖➖➖➖➖

🎯 Today activity:
-Chuck table mounter vacuum leak. Change new tube-solved
-Bug checking: Error found at Thermal release- not detect carrier if vacuum out of spec.
-Buy off 3 wafer. OK, no error/reject found.

Note:
Buy off 3 wafer: 10 min 38 sec - No issue
Now pending verified all close loop system with Software Engineer.
Jacky software, pls come tomorrow

30-MAY-2016

🕸 Report date: 30-MAY-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯Install label linear remover assembly
Progress: 50%
Current status: Design concept final stage. Pending fabrication.
Due date: 17-June-2016 (improvement plan-can buy off without this first)

🎯 MC not detect if temperature thermal release out of spec
Progress:0%
Current status: Pending software
Due date: TBA

🎯 Barcode installation &  system server (if fail OCR)
Progress: 10%
Current status: Need to manual key in using key board if OCR fail to read (but still have potiential for wrong input). Recommend Barcode scanner to install in order to ensure no failure (poka yoke)- 2nd priority
Current status: Under discussion with waftech group.

Overall progress to production mode: 83%

➖➖➖➖➖➖➖➖

WAFTECH#3 CU PILLAR UPDATE

🎯UV detaper not effective enough
Progress: 20%
Current status: Hardware designing stage.
Due date: 27 June 2016

➖➖➖➖➖➖➖➖

🎯 Today activity:
-Fix known outstanding software bug
-Simulate wafer run to verify software bug.
-Change glass unstack sequence to make machine more stable.

Note:
waftech pls work out on close loop control system as per email asap

28-MAY-2016

🕸 Report date: 28-MAY-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯Install label linear remover assembly
Progress: 50%
Current status: Design concept final stage. Pending fabrication.
Due date: 17-June-2016 (improvement plan-can buy off without this first)

🎯 MC not detect if temperature thermal release out of spec
Progress:0%
Current status: Pending software
Due date: TBA

🎯 Barcode installation &  system server (if fail OCR)
Progress: 10%
Current status: Need to manual key in using key board if OCR fail to read (but still have potiential for wrong input). Recommend Barcode scanner to install in order to ensure no failure (poka yoke)- 2nd priority
Current status: Under discussion with waftech group.

Overall progress to production mode: 83%

➖➖➖➖➖➖➖➖

WAFTECH#3 CU PILLAR UPDATE

🎯UV detaper not effective enough
Progress: 20%
Current status: Hardware designing stage.
Due date: 27 June 2016

➖➖➖➖➖➖➖➖

🎯 Today activity:
-Fix known outstanding software bug
-Simulate wafer run to verify software bug.
-Change glass unstack sequence to make machine more stable.

Note:
waftech pls work out on close loop control system as per email asap.

27-MAY-2016

🕸 Report date: 27-MAY-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯Install label linear remover assembly
Progress: 40%
Current status: Design concept final stage. Pending fabrication.
Due date: 17-June-2016 (improvement plan-can buy off without this first)

🎯Software: Pick & Place label "recovery mode" if mc fail to place/pick the label.
Progress: 0%
Current status: Awaiting software engineer next Monday.
Due date: 3-June-2016

🎯 Barcode installation &  system server (if fail OCR)
Progress: 10%
Current status: Need to manual key in using key board if OCR fail to read (but still have potiential for wrong input). Recommend Barcode scanner to install in order to ensure no failure (poka yoke)
Current status: Under discussion with waftech group.

Overall progress to production mode: 80%

➖➖➖➖➖➖➖➖

WAFTECH#3 CU PILLAR UPDATE

🎯UV detaper not effective enough
Progress: 20%
Current status: Hardware designing stage.
Due date: 27 June 2016

➖➖➖➖➖➖➖➖

🎯 Today activity:
-Fix & verify circular cutter performance. Lifted tape solve by change the sequence.
-Further compile additional software bug for software engineer.

Note:
BS Teoh pls discuss with Alex on add-on hand held barcode scanning system

25-MAY-2016

🕸 Report date: 25-MAY-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯Thermal release (improper release near to the sticker)
Progress: 95%
Current status: Evaluation done. The best result based on UPH & Quality is 150C vs 20sec. Need buy off more wafer.
Due date: 25-May-2016

🎯Install label linear remover assembly
Progress: 10%
Current status: Design concept final stage. Pending fabrication.
Due date: 17-June-2016 (improvement plan-can buy off without this first)

🎯Software: Pick & Place label "recovery mode" if mc fail to place/pick the label.
Progress: 0%
Current status: Facing this problem today during buy off. In progress under software.
Due date: TBA

🎯 Barcode installation &  system server (if fail OCR)
Progress: 10%
Current status: Need to manual key in using key board if OCR fail to read (but still have potiential for wrong input). Recommend Barcode scanner to install in order to ensure no failure (poka yoke)
Current status: Under discussion with waftech group.
Due date: TBA

➖➖➖➖➖➖➖➖

WAFTECH#3 CU PILLAR UPDATE

🎯UV detaper not effective enough
Progress: 20%
Current status: Hardware designing stage.
Due date: 27 June 2016

➖➖➖➖➖➖➖➖

🎯 Today activity:
-Fix the temperature system & controller
-Optimize the thermal release parameter (temp vs time - 5x5 matrix)
-Loosen the magazine part (too tight)

24-MAY-2016

🕸 Report date: 24-MAY-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯Thermal release (improper release near to the sticker)
Progress: 60%
Current status: Evaluation on time / temperature. But temperature inconsistant. Will fix the temperature system (today buy off failed)
Due date: 25-May-2016

🎯Install label linear remover assembly
Progress: 10%
Current status: Design concept final stage. Pending fabrication.
Due date: 17-June-2016 (improvement plan-can buy off without this first)


➖➖➖➖➖➖➖➖

WAFTECH#3 CU PILLAR UPDATE

🎯UV detaper not effective enough
Progress: 20%
Current status: Hardware designing stage.
Due date: 27 June 2016

➖➖➖➖➖➖➖➖

🎯 Today activity:
-Replace Taping 2 to Taping 1 blade holder waftech#01 (Cu SMT). Waftech will change the blade holder material and estimation to arrive on Friday. For Cu Pillar, cant run since it need both blade function.
-Evaluate thermal release on time (no effect). Tomorrow will continue play with temperature time when the temperature system fix.

Note:
Waftech group, pls ensure to attend meeting at 5.30pm every working days.

23-MAY-2016

🕸 Report date: 23-MAY-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯no update for today. Waftech offday.

note: taping 1 blade holder broken during run waftech#1. pls fix asap.

20-MAY-2016

🕸 Report date: 20-MAY-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯Thermal release (improper release near to the sticker)
Progress: 40%
Current status: Still continue to fine tune parameter for the best result (today buy off failed)
Due date: 25-May-2016

🎯Install label linear remover assembly
Progress: 10%
Current status: Design concept final stage. Pending fabrication.
Due date: 17-June-2016 (improvement plan-can buy off without this first)

NEW ISSUE
🎯Sofware bug during cancel job. Msg "Job-Pls remove cassette".
Progress: 0%
Current status: To be highlighted software engineer.
Due Date: 24-May-2016

🎯Software: Incomplete retry sequence - at mounting side
Progress: 0%
Current status: To be highlighted software engineer.
Due Date: 24-May-2016

🎯Software: Carrier eject sequence inter-mitten fail to execute.
Current status: To be highlighted software engineer.
Due Date: 24-May-2016


➖➖➖➖➖➖➖➖

WAFTECH#3 CU PILLAR UPDATE

🎯UV detaper not effective enough
Progress: 20%
Current status: Hardware designing stage.
Due date: 27 June 2016

➖➖➖➖➖➖➖➖

🎯 Today activity:
-Carrier stack sensor (today failed & today solved)
-Mounting tape preparation inconsistent issue (solved - correct mechanical alignment)
-Thermal release: change sequence mode (part of release quality)(improved but not 100% release - cont' on Monday)

Note: Too much software issue. Can waftech please assign software engineer to have more time here?

19-May-2016

🕸Report date: 19-MAY-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯Thermal release (improper release near to the sticker)
Progress: 25%
Current status: Still fine tune parameter for the best result.
Due date: 25-May-2016

🎯Install label linear remover assembly
Progress: 10%
Current status: Design concept final stage. Pending fabrication.
Due date: 17-June-2016 (improvement plan-can buy off without this first)


➖➖➖➖➖➖➖➖

WAFTECH#3 CU PILLAR UPDATE

🎯UV detaper not effective enough
Progress: 20%
Current status: Hardware designing stage.
Due date: 27 June 2016

➖➖➖➖➖➖➖➖

🎯 Today activity:
-Software outstanding issue (format font, retry mode)(done)
-Mechanical setting for thermal release (not complete yet)