03-JUN-2016

🕸 Report date: 03-JUN-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯Install label linear remover assembly
Progress: 65%
Current status: Design concept final stage 90%. Pending fabrication.
Due date: 17-June-2016 (improvement plan-can buy off without this first)

🎯 MC not detect if temperature thermal release out of spec
Progress:50%
Current status: Pending software
Due date: TBA
(Temperature controller setup complete, pending software)

🎯 Barcode installation &  system server (if fail OCR)
Progress: 10%
Current status: Need to manual key in using key board if OCR fail to read (but still have potiential for wrong input). Recommend Barcode scanner to install in order to ensure no failure (poka yoke)- 2nd priority
Current status: Under discussion with waftech group.

🎯 Close loop control system & verification
Progress:57%
Current status: Still under verification & improvement.
Due date: 7-June-2016


Overall progress to production mode: 83.5%

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WAFTECH#3 CU PILLAR UPDATE

🎯UV detaper not effective enough
Progress: 20%
Current status: Hardware designing stage.
Due date: 27 June 2016

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🎯 Today activity:
-Continue cycle run with dummies (15pcs) to verify machine consistency and performance.
-Increase transfer arm pick and place speed. Found that software need to add in deceleration while transfer arm pick, or place (slow down).
-Few software issue detected today at transfer arm pick and place. Already discuss with Jacky

02-JUN-2016

🕸 Report date: 02-JUN-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯Install label linear remover assembly
Progress: 65%
Current status: Design concept final stage 90%. Pending fabrication.
Due date: 17-June-2016 (improvement plan-can buy off without this first)

🎯 MC not detect if temperature thermal release out of spec
Progress:50%
Current status: Pending software
Due date: TBA
(Temperature controller setup complete, pending software)

🎯 Barcode installation &  system server (if fail OCR)
Progress: 10%
Current status: Need to manual key in using key board if OCR fail to read (but still have potiential for wrong input). Recommend Barcode scanner to install in order to ensure no failure (poka yoke)- 2nd priority
Current status: Under discussion with waftech group.

🎯 Close loop control system & verification
Progress:55%
Current status: Still under verification & improvement.
Due date: 7-June-2016


Overall progress to production mode: 83.5%

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WAFTECH#3 CU PILLAR UPDATE

🎯UV detaper not effective enough
Progress: 20%
Current status: Hardware designing stage.
Due date: 27 June 2016

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🎯 Today activity:
-Continue cycle run with dummies (20pcs) to verify machine consistency and performance.
-Encounter mounting waste tape gripper was intermittent to grip waste yape with both gripper. Add in a fabrication part (temporary) to support waste tape, the result is more stable and consistency.
-Few software issue detected today. Mounter tape low alarm, must detect before start a new job, or it will be hard to access into machine to replace a new tape.
-Machine not detect if thermal release out of spec. Temperature controller set up complete, pending for software to update

01-JUN-2016

🕸 Report date: 01-JUN-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯Install label linear remover assembly
Progress: 65%
Current status: Design concept final stage 80%. Pending fabrication.
Due date: 17-June-2016 (improvement plan-can buy off without this first)

🎯 MC not detect if temperature thermal release out of spec
Progress:0%
Current status: Pending software
Due date: TBA

🎯 Barcode installation &  system server (if fail OCR)
Progress: 10%
Current status: Need to manual key in using key board if OCR fail to read (but still have potiential for wrong input). Recommend Barcode scanner to install in order to ensure no failure (poka yoke)- 2nd priority
Current status: Under discussion with waftech group.

🎯 Close loop control system & verification
Progress:55%
Current status: Still under verification & improvement.
Due date: 7-June-2016


Overall progress to production mode: 83.5%

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WAFTECH#3 CU PILLAR UPDATE

🎯UV detaper not effective enough
Progress: 20%
Current status: Hardware designing stage.
Due date: 27 June 2016

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🎯 Today activity:
-Continue cycle run with dummies (40pcs) to verify machine consistency and performance.
-Encounter mounting tape pincher sequence need improvement. To be discuss with software.
-Few software bug detected today, and already highlighted to software engineer for improvement.

note:
Lim/Chan/Jacky, pls expedite to provide "Manual Book" which consist:
1- Mc Part List
2- SOP/WI
3- Engineering Maintenance/PM & Periodic
4- Troubleshooting (error code-remedies-to-fix
5. Consumables Part

31-MAY-2016

🕸 Report date: 31-MAY-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯Install label linear remover assembly
Progress: 60%
Current status: Design concept final stage. Pending fabrication.
Due date: 17-June-2016 (improvement plan-can buy off without this first)

🎯 MC not detect if temperature thermal release out of spec
Progress:0%
Current status: Pending software
Due date: TBA

🎯 Barcode installation &  system server (if fail OCR)
Progress: 10%
Current status: Need to manual key in using key board if OCR fail to read (but still have potiential for wrong input). Recommend Barcode scanner to install in order to ensure no failure (poka yoke)- 2nd priority
Current status: Under discussion with waftech group.

🎯 Close loop control system & verification
Progress:40%
Current status: Only pick&place, labeling, and robot arm verified. Others will continue check.
Due date: 7-June-2016


Overall progress to production mode: 83.5%

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WAFTECH#3 CU PILLAR UPDATE

🎯UV detaper not effective enough
Progress: 20%
Current status: Hardware designing stage.
Due date: 27 June 2016

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🎯 Today activity:
-Chuck table mounter vacuum leak. Change new tube-solved
-Bug checking: Error found at Thermal release- not detect carrier if vacuum out of spec.
-Buy off 3 wafer. OK, no error/reject found.

Note:
Buy off 3 wafer: 10 min 38 sec - No issue
Now pending verified all close loop system with Software Engineer.
Jacky software, pls come tomorrow

30-MAY-2016

🕸 Report date: 30-MAY-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯Install label linear remover assembly
Progress: 50%
Current status: Design concept final stage. Pending fabrication.
Due date: 17-June-2016 (improvement plan-can buy off without this first)

🎯 MC not detect if temperature thermal release out of spec
Progress:0%
Current status: Pending software
Due date: TBA

🎯 Barcode installation &  system server (if fail OCR)
Progress: 10%
Current status: Need to manual key in using key board if OCR fail to read (but still have potiential for wrong input). Recommend Barcode scanner to install in order to ensure no failure (poka yoke)- 2nd priority
Current status: Under discussion with waftech group.

Overall progress to production mode: 83%

➖➖➖➖➖➖➖➖

WAFTECH#3 CU PILLAR UPDATE

🎯UV detaper not effective enough
Progress: 20%
Current status: Hardware designing stage.
Due date: 27 June 2016

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🎯 Today activity:
-Fix known outstanding software bug
-Simulate wafer run to verify software bug.
-Change glass unstack sequence to make machine more stable.

Note:
waftech pls work out on close loop control system as per email asap

28-MAY-2016

🕸 Report date: 28-MAY-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯Install label linear remover assembly
Progress: 50%
Current status: Design concept final stage. Pending fabrication.
Due date: 17-June-2016 (improvement plan-can buy off without this first)

🎯 MC not detect if temperature thermal release out of spec
Progress:0%
Current status: Pending software
Due date: TBA

🎯 Barcode installation &  system server (if fail OCR)
Progress: 10%
Current status: Need to manual key in using key board if OCR fail to read (but still have potiential for wrong input). Recommend Barcode scanner to install in order to ensure no failure (poka yoke)- 2nd priority
Current status: Under discussion with waftech group.

Overall progress to production mode: 83%

➖➖➖➖➖➖➖➖

WAFTECH#3 CU PILLAR UPDATE

🎯UV detaper not effective enough
Progress: 20%
Current status: Hardware designing stage.
Due date: 27 June 2016

➖➖➖➖➖➖➖➖

🎯 Today activity:
-Fix known outstanding software bug
-Simulate wafer run to verify software bug.
-Change glass unstack sequence to make machine more stable.

Note:
waftech pls work out on close loop control system as per email asap.

27-MAY-2016

🕸 Report date: 27-MAY-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯Install label linear remover assembly
Progress: 40%
Current status: Design concept final stage. Pending fabrication.
Due date: 17-June-2016 (improvement plan-can buy off without this first)

🎯Software: Pick & Place label "recovery mode" if mc fail to place/pick the label.
Progress: 0%
Current status: Awaiting software engineer next Monday.
Due date: 3-June-2016

🎯 Barcode installation &  system server (if fail OCR)
Progress: 10%
Current status: Need to manual key in using key board if OCR fail to read (but still have potiential for wrong input). Recommend Barcode scanner to install in order to ensure no failure (poka yoke)
Current status: Under discussion with waftech group.

Overall progress to production mode: 80%

➖➖➖➖➖➖➖➖

WAFTECH#3 CU PILLAR UPDATE

🎯UV detaper not effective enough
Progress: 20%
Current status: Hardware designing stage.
Due date: 27 June 2016

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🎯 Today activity:
-Fix & verify circular cutter performance. Lifted tape solve by change the sequence.
-Further compile additional software bug for software engineer.

Note:
BS Teoh pls discuss with Alex on add-on hand held barcode scanning system

25-MAY-2016

🕸 Report date: 25-MAY-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯Thermal release (improper release near to the sticker)
Progress: 95%
Current status: Evaluation done. The best result based on UPH & Quality is 150C vs 20sec. Need buy off more wafer.
Due date: 25-May-2016

🎯Install label linear remover assembly
Progress: 10%
Current status: Design concept final stage. Pending fabrication.
Due date: 17-June-2016 (improvement plan-can buy off without this first)

🎯Software: Pick & Place label "recovery mode" if mc fail to place/pick the label.
Progress: 0%
Current status: Facing this problem today during buy off. In progress under software.
Due date: TBA

🎯 Barcode installation &  system server (if fail OCR)
Progress: 10%
Current status: Need to manual key in using key board if OCR fail to read (but still have potiential for wrong input). Recommend Barcode scanner to install in order to ensure no failure (poka yoke)
Current status: Under discussion with waftech group.
Due date: TBA

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WAFTECH#3 CU PILLAR UPDATE

🎯UV detaper not effective enough
Progress: 20%
Current status: Hardware designing stage.
Due date: 27 June 2016

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🎯 Today activity:
-Fix the temperature system & controller
-Optimize the thermal release parameter (temp vs time - 5x5 matrix)
-Loosen the magazine part (too tight)

24-MAY-2016

🕸 Report date: 24-MAY-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯Thermal release (improper release near to the sticker)
Progress: 60%
Current status: Evaluation on time / temperature. But temperature inconsistant. Will fix the temperature system (today buy off failed)
Due date: 25-May-2016

🎯Install label linear remover assembly
Progress: 10%
Current status: Design concept final stage. Pending fabrication.
Due date: 17-June-2016 (improvement plan-can buy off without this first)


➖➖➖➖➖➖➖➖

WAFTECH#3 CU PILLAR UPDATE

🎯UV detaper not effective enough
Progress: 20%
Current status: Hardware designing stage.
Due date: 27 June 2016

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🎯 Today activity:
-Replace Taping 2 to Taping 1 blade holder waftech#01 (Cu SMT). Waftech will change the blade holder material and estimation to arrive on Friday. For Cu Pillar, cant run since it need both blade function.
-Evaluate thermal release on time (no effect). Tomorrow will continue play with temperature time when the temperature system fix.

Note:
Waftech group, pls ensure to attend meeting at 5.30pm every working days.

23-MAY-2016

🕸 Report date: 23-MAY-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯no update for today. Waftech offday.

note: taping 1 blade holder broken during run waftech#1. pls fix asap.

20-MAY-2016

🕸 Report date: 20-MAY-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯Thermal release (improper release near to the sticker)
Progress: 40%
Current status: Still continue to fine tune parameter for the best result (today buy off failed)
Due date: 25-May-2016

🎯Install label linear remover assembly
Progress: 10%
Current status: Design concept final stage. Pending fabrication.
Due date: 17-June-2016 (improvement plan-can buy off without this first)

NEW ISSUE
🎯Sofware bug during cancel job. Msg "Job-Pls remove cassette".
Progress: 0%
Current status: To be highlighted software engineer.
Due Date: 24-May-2016

🎯Software: Incomplete retry sequence - at mounting side
Progress: 0%
Current status: To be highlighted software engineer.
Due Date: 24-May-2016

🎯Software: Carrier eject sequence inter-mitten fail to execute.
Current status: To be highlighted software engineer.
Due Date: 24-May-2016


➖➖➖➖➖➖➖➖

WAFTECH#3 CU PILLAR UPDATE

🎯UV detaper not effective enough
Progress: 20%
Current status: Hardware designing stage.
Due date: 27 June 2016

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🎯 Today activity:
-Carrier stack sensor (today failed & today solved)
-Mounting tape preparation inconsistent issue (solved - correct mechanical alignment)
-Thermal release: change sequence mode (part of release quality)(improved but not 100% release - cont' on Monday)

Note: Too much software issue. Can waftech please assign software engineer to have more time here?

19-May-2016

🕸Report date: 19-MAY-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯Thermal release (improper release near to the sticker)
Progress: 25%
Current status: Still fine tune parameter for the best result.
Due date: 25-May-2016

🎯Install label linear remover assembly
Progress: 10%
Current status: Design concept final stage. Pending fabrication.
Due date: 17-June-2016 (improvement plan-can buy off without this first)


➖➖➖➖➖➖➖➖

WAFTECH#3 CU PILLAR UPDATE

🎯UV detaper not effective enough
Progress: 20%
Current status: Hardware designing stage.
Due date: 27 June 2016

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🎯 Today activity:
-Software outstanding issue (format font, retry mode)(done)
-Mechanical setting for thermal release (not complete yet)

5TH round jalan waftech

Inspection by firdaus.
Yield - 21/25 =  84%

1 - bubble
2 - OK
3 - OK
4 - BUBBLE tepi
5 - OK
6 - OK
7 - OK
8 - OK
9 - OK
10- OK
11- OK
12- bubble
13- OK
14- OK
15- OK
16- OK
17- OK
18- OK
19- OK
20- OK
21- BUBBLE
22- OK
23- OK
24- OK
25- OK

Cu pillar waftech 1 & 2

Jalan cu pillar 6 keping no issue..

Lepas tu yang cutting tape dok lari tu dah ejas roller guide..

Isnin minggu depan test..

4th round jalan

9 bubble
1 - excessive tape
15 ok

3rd round jalan waftech 1

Kali ketiga mesin ada some bug on software. Machine hang.
Error: Robot presence error

2nd round test

After tape alignment by lim
Summary:
14 ok
9 bubble
1 excessive tape

Small bubble

Small bubble

OK

Small bubble

Small bubble

Small bubble

ok

Bubble

ok

ok

ok

ok

ok

ok

Bubble & excessive tape

ok

ok

ok

small bubble

ok

ok

bubble

small bubble

bubble

ok

Mesin sudah OK, cuma ada masalah bubble & tape alignment

Buy off 25 carrier:

Summary:
11 OK
1 Bubble
13 Cutting offset starting carrier#13
Yield: 44%
No error during running

ok

ok

ok

ok

ok

ok

ok

bubble

ok

ok

ok

ok

cutting offset

SK Lim will install block to align the tape.