30-MAY-2016

🕸 Report date: 30-MAY-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯Install label linear remover assembly
Progress: 50%
Current status: Design concept final stage. Pending fabrication.
Due date: 17-June-2016 (improvement plan-can buy off without this first)

🎯 MC not detect if temperature thermal release out of spec
Progress:0%
Current status: Pending software
Due date: TBA

🎯 Barcode installation &  system server (if fail OCR)
Progress: 10%
Current status: Need to manual key in using key board if OCR fail to read (but still have potiential for wrong input). Recommend Barcode scanner to install in order to ensure no failure (poka yoke)- 2nd priority
Current status: Under discussion with waftech group.

Overall progress to production mode: 83%

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WAFTECH#3 CU PILLAR UPDATE

🎯UV detaper not effective enough
Progress: 20%
Current status: Hardware designing stage.
Due date: 27 June 2016

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🎯 Today activity:
-Fix known outstanding software bug
-Simulate wafer run to verify software bug.
-Change glass unstack sequence to make machine more stable.

Note:
waftech pls work out on close loop control system as per email asap