Day 17

Inari attendance:
1. Alif (013-4063267)

Waftech attendance:

N/A

WAFTECH # 1
Progress:

1. Run 1 cassette (25 wafers). Detected excessive tape start wafer number 14 due to alignment out. Need to reteach the rotary arm of the cutter. (new pending)

 Old Pending:

1. Software having some issue. Loss memory. Need to setting back all the recipe and teaching. Currently only 1 recipe have been set (Cu Pad). Waftech will trigger programmer on this due to program issue (cannot save recipe). -1 day ago

WAFTECH # 2
Progress:

N/A. Stable already. UPH-30 wafers/h

WAFTECH # 3
Progress: 

N/A

Old Pending:

1. New robot arm need to modify due to fabrication error. Target next tuesday -11 days ago

Day 16

Inari attendance:
1. Alif (013-4063267)
2. Lokman Trainee (010-5614518)

Waftech attendance:
1. Chan Jr (018-9449917)
2. Khai (016-5078149)

3. CS Kang (016-4384807)-half day

WAFTECH # 1
Progress:

1. Software having some issue. Loss memory. Need to setting back all the recipe and teaching. Currently only 1 recipe have been set (Cu Pad). Waftech will trigger programmer on this due to program issue (cannot save recipe). (new pending)

2. Run yloss Cu Pad 20  wafers. (done, no issue)

WAFTECH # 2
Progress:

1. No issue. Consider stable already. (done)

2. UPH calculation by IE (done)

WAFTECH # 3
Progress: 

1. install laser aligner for 6" (done)
2. To change the amplifier value setting on thermal release side (done)
4. Connection to shopfloor done bar code (done)

Old Pending:

1. New robot arm need to modify due to fabrication error. -10 days ago

Day 15

Inari attendance:
1. Alif (013-4063267)
2. Lokman Trainee (010-5614518)

Waftech attendance:
1. Chan Jr (018-9449917)
2. Khai (016-5078149)

WAFTECH # 1
Progress:

1.  Run yloss Cu Pad 30 wafers. No issue during running, and result no reject.(done)

2. Run yloss Cu Pillar 30 wafers.  Bubble 1 wafer due to particle trap, 2nd run OK. (done)

3. Send 10 x 3 wafers data Cu Pad to BS Teoh. (done)

4. Tomorrow will calculate the UPH, and tape usage, material cost/wafer by IE & Engineering. (new pending)

 

WAFTECH # 2
Progress:

1. No issue. Consider stable already. (done)

2. Tomorrow will calculate the UPH & material cost/wafer by IE & Engineering (new pending)

WAFTECH # 3
Progress: 

1. Tomorrow will install new robot arm and new laser aligner (before this fiber aligner cant detect glass carrier).

Old Pending:

1. Solution for - glass carrier detection error at aligner.-14 days ago
2. Pending new robot arm from waftech -9 days ago

Bubble caused by partice

Testing unclean carrier on Waftech 2. Can capture the bubble. Good.

Day 14

Inari attendance:
1. Alif (013-4063267)
2. Lokman Trainee (010-5614518)

Waftech attendance:
1. Chan Jr (018-9449917)
2. Khai (016-5078149)

WAFTECH # 1
Progress:
1. Install new roller (teflon type, before this rubber type) on taping 2 side. (done)

2.  Run yloss Cu Pad 30 wafers. No issue during running, and result no reject.(done)

3. Run yloss Cu Pillar 20 wafers.  Bubble 1 wafer, 2nd run OK. (done)

4. Optimization to ensure zero bubble on Cu Pillar.(new pending)
5. Send report out to BS Teoh (new pending)
6. Tomorrow continue monitoring

WAFTECH # 2
Progress:

1. No issue. Consider stable already. (done)

WAFTECH # 3
Progress: 

1. Installation ADLink card for bar code labeller. (done)

Old Pending:

1. Solution for - glass carrier detection error at aligner.-13 days ago
2. Pending new robot arm from waftech -8 days ago

Day 13

Inari attendance:
1. Alif (013-4063267)

2. Lokman Trainee (010-5614518)

Waftech attendance:
1. Chan Jr (018-9449917)
2. Khai (016-5078149)

WAFTECH # 1
Progress:
1. Bubble line detected during speed 70%. For temporary/containment plan, the machine run at 20% of roller speed to avoid bubble, but it will reduce UPH from 34 to 28 wafers. For CA: Need to change to new roller (at taping 2 side), waftech commit to install new type of roller tomorrow, since the old type 3 times change.(new pending)

2.  Run Cu Pillar 10 wafers, done. 1 out of 10 having small bubble. Others, no issue. (done)

3. Run Cu Pad 10 wafers with roller speed 20%, no issue. (done)

4.  Tomorrow will continue with 3 times cycle of 10 wafers Cu Pad & Cu Pillar after replace to new roller at taping 2.(new pending)

5. Target to close all issue by tomorrow.(new pending)

WAFTECH # 2
Progress:

1. No issue. Consider stable already. (done)

WAFTECH # 3
Progress: 

NA. No man power.

Old Pending:

1. Solution for - glass carrier detection error at aligner.-12 days ago
2. Robot arm hit the aligner and caused robot arm bent. Waftech dismantle the robot arm and bring it back to waftech's office -7 days ago 

Day 12

Inari attendance:

1. Alif (013-4063267)

2. Lokman Trainee (010-5614518)

Waftech attendance:
1. Chan Jr (018-9449917)
2. Khai (016-5078149)

3. CS Kang (016-4384807)-half day

WAFTECH # 1
Progress:
1. Tape excessive done adjusted the position, teached by Khai (under monitoring)

2.  Run Cu Pillar 20 wafer. 18 wafer done lamination without any problem, 2 more not done due to out of stock.

WAFTECH # 2
Progress:

1. Re-activate roller at peeling side by CS Kang. (done)

2. Run for 25 wafers Cu Pad yloss dummy. (done- no issue).

WAFTECH # 3
Progress: 

1. Install N2 pipeline for UV Cure by Hamdan / Peter. (done)

Old Pending:

1. Solution for - glass carrier detection error at aligner.-11 days ago
2. Robot arm hit the aligner and caused robot arm bent. Waftech dismantle the robot arm and bring it back to waftech's office -6 days ago

*Done create recording sheet and OCAP for waftech 1 and 2
 

Day 11

Off Day

Day 10

Off Day

Day 9

Inari attendance:

1. Alif (013-4063267)

2. Lokman Trainee (010-5614518)

Waftech attendance:
1. Chan Jr (018-9449917)
2. Khai (016-5078149)

3. SK Lim (016-4816770)-half day

WAFTECH # 1
Progress:
1. Tape excessive done adjusted the position, program by SK Lim (solved)

3. Convert carrier to laminate process (done)
3. Observed tape delamination. CA: Tune the tape to 5.5cm (between two wafer).(solved)

4. After have a good result from 5 times carrier test, try run 25 wafers. Wafer 1 to 5 having no problem, but starting from wafer no 6, the cutting start to offset on the both flat notch. (new pending)

5. No bubble detected during test run 25 wafer. (done)

 

WAFTECH # 2
Progress:

1. Turn ON back waftech#2 for Cu Pad. Detected the roller on peel side does not work due to program setting issue. Awaiting CS Kang to re-program (new pending).

2.  Add on shim on stopper at carrier-wafer attach side. No alignment issue. (done)

 

WAFTECH # 3
Progress:
Idle. No Man Power.

 

Old Pending:
1. Solution for - glass carrier detection error at aligner.-8 days ago
2. Robot arm hit the aligner and caused robot arm bent. Waftech dismantle the robot arm and bring it back to waftech's office -3 days ago  

Day 8

Inari attendance:
1. Alif (013-4063267)

Waftech attendance:
1. Chan Jr (018-9449917)
2. Khai (016-5078149) -half day

WAFTECH # 1
Progress:
Idle
Meeting with BS Teoh to change from carrier laminate to wafer laminate

Old Pending:
1.  New program (offset cutting issue) from Dr Yu (conduct by Waftech) -5 days ago


WAFTECH # 3
Progress:
1. Pincher not fully release the SPV-214 tape residue (solved)
 
Old Pending:
1. Solution for - glass carrier detection error at aligner.-7 days ago
2. Robot arm hit the aligner and caused robot arm bent. Waftech dismantle the robot arm and bring it back to waftech's office -2 days ago

Day 7

Inari attendance:
1. Alif (013-4063267)

Waftech attendance:
1. Chan Jr (018-9449917)
2. Khai (016-5078149)

WAFTECH # 1
Progress:
Idle

Old Pending:
1.  New program (offset cutting issue) from Dr Yu (conduct by Waftech) -4 days ago


WAFTECH # 3
Progress:
1. Verify software correction (solved)
3. Verify Mis-alignment on thermal release table. (solved) 
3. Pincher not fully release the SPV-214 tape residue (new pending)
 

Old Pending:
1. Solution for - glass carrier detection error at aligner.-6 days ago
2. Robot arm hit the aligner and caused robot arm bent. Waftech dismantle the robot arm and bring it back to waftech's office -1 day ago

Day 6

Inari attendance:
1. Alif (013-4063267)

Waftech attendance:
1. Chan Jr (018-9449917)
2. Khai (016-5078149)
3. CS Kang (016-4384807)

WAFTECH # 1
Progress:
Send email to BS Teoh last report (wafer laminate report).

Old Pending:
1.  New program (offset cutting issue) from Dr Yu (conduct by Waftech) -3 days ago


WAFTECH # 3
Progress:
1. Software bug solved by CS Kang (solved-pending verification)
2. Robot arm hit the aligner and caused robot arm bent. Waftech dismantle the robot arm and bring it back to waftech's office (new pending)
3. Mis-alignment on thermal release table. (new problem detected and solved-pending verification) 
4.  Solution for - Vacuum holder stuck to the carrier+thermal tape after thermal release. NPI side no issue since carrier only will be removed. (solved)


Old Pending:
1. Solution for - glass carrier detection error at aligner.-5 days ago

robot arm bent

 

Day 5

Inari attendance:
1. Alif (013-4063267)

Waftech attendance:
1. Chan Jr (018-9449917)
2. Khai (016-5078149)

WAFTECH # 1
Progress:
NA.

Old Pending:
1.  New program (offset cutting issue) from Dr Yu (conduct by Waftech) -2 days ago


WAFTECH # 3
Progress:
1. Wafer placement error at aligner (solved)
2.  Software keep trigger error EXCEPTION - RESET NOT ALLOW until end of the day. Awaiting CS Kang to solve tomorrow.(new pending)


Old Pending:
1. Solution for - glass carrier detection error at aligner.-4 days ago
2. Solution for - Vacuum holder stuck to the carrier+thermal tape after thermal release. NPI side no issue since carrier only will be removed. (suggestion: put blower to blow the carrier+thermal tape) -3 days ago
3. Software detected have bug, not wafer loading not follow the sequence, only run 1 wafer then stop. 1 day ago 
4.  Continue testing for thermal release after correlation.1 day ago

Day 4

offday

Day 3

Inari attendance:
1. Alif (013-4063267)

Waftech attendance: (half day)
1. Chan Jr (018-9449917)
2. Khai (016-5078149)

WAFTECH # 1
Progress:
NA.

Old Pending:
1.  New program (offset cutting issue) from Dr Yu (conduct by Waftech)


WAFTECH # 3
Progress:
1.  Corrrelate thermal release temperature to the actual temperature on surface chuck table (130C). Before this set 150 but the actual is 120. (solved)
2. Align the wafer to accurate position by offset 2 degree.(solved)
3. Software detected have bug, not wafer loading not follow the sequence, only run 1 wafer then stop. (new pending)
4.  Do correction on mounter chuck table (before this wrong position). (solved)
5.  Continue testing for thermal release after correlation.(new pending)

Old Pending:
1. Solution for - Wafer placement error at aligner. (suggestion: robot arm release the wafer first, then  aligner vacuum will suck the wafer instead of aligner suck the wafer first then robot arm release the wafer).-1 day ago
2. Solution for - glass carrier detection error at aligner.-1 day ago
3. Solution for - Vacuum holder stuck to the carrier+thermal tape after thermal release. NPI side no issue since carrier only will be removed. (suggestion: put blower to blow the carrier+thermal tape) -1 day ago

Correct position for chuck mounter

Day 2

Inari attendance:
1. Alif (013-4063267)
2. Lokman Trainee (010-5614518)

Waftech attendance:
1. Chan Jr (018-9449917)
2. Khai (016-5078149)


WAFTECH # 1
Progress:
1. Bubble solve-by lower down the height of chuck table (remove 1 out of 3 shim).(solved)
2. Cu Piller using 3 shim, Production Carrier using 2 shim. Every conversion need to adjust the shim.
3. Cutting offset -  waftech stated they will contact Dr yee from China to adjust the program. Expectation date will be informed later by Waftech. (new pending)

No bubble

Remove shim

Excessive tape-need improve the program

WAFTECH # 3
Progress:
1. Vacuum holder stuck to the carrier+thermal tape after thermal release. NPI side no issue since carrier only will be removed.(new pending)
2. Glass carrier still cannot align. Awaiting solution from Waftech.(new pending)
3. Robort arm need manual touch then the wafer will placed at the aligner. Wafer placement error at aligner. (new pending)
4. Improper release on thermal release. Refer below photo. Bypass thermostat and will continue the progress tomorrow.(new pending)

Improper release

Day 1 after review with Sabran

Inari attendance:
1. Alif (013-4063267)
2. Lokman Trainee (010-5614518)
Waftech attendance:
NA

WAFTECH # 1
Progress:
1. Setup back waftech after long time idle.
2. Replace purple tape with white tape (production).
3. Test run silicon production. Somebody change the program, its run like cu piller step.
4. Bypass taping 1, continue test.
5. Observed roller loose. tape delamination, bubble & cutting offset.
6. Tighten the roller, adjust the speed of roller, same result.

Bubble

Offset cutting

Loose roller

WAFTECH # 3 

Idle. No progress due to no waftech worker.

From March to Sept 2015

WAFTECH #1

WAFTECH#3