25-MAY-2016

🕸 Report date: 25-MAY-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯Thermal release (improper release near to the sticker)
Progress: 95%
Current status: Evaluation done. The best result based on UPH & Quality is 150C vs 20sec. Need buy off more wafer.
Due date: 25-May-2016

🎯Install label linear remover assembly
Progress: 10%
Current status: Design concept final stage. Pending fabrication.
Due date: 17-June-2016 (improvement plan-can buy off without this first)

🎯Software: Pick & Place label "recovery mode" if mc fail to place/pick the label.
Progress: 0%
Current status: Facing this problem today during buy off. In progress under software.
Due date: TBA

🎯 Barcode installation &  system server (if fail OCR)
Progress: 10%
Current status: Need to manual key in using key board if OCR fail to read (but still have potiential for wrong input). Recommend Barcode scanner to install in order to ensure no failure (poka yoke)
Current status: Under discussion with waftech group.
Due date: TBA

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WAFTECH#3 CU PILLAR UPDATE

🎯UV detaper not effective enough
Progress: 20%
Current status: Hardware designing stage.
Due date: 27 June 2016

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🎯 Today activity:
-Fix the temperature system & controller
-Optimize the thermal release parameter (temp vs time - 5x5 matrix)
-Loosen the magazine part (too tight)

24-MAY-2016

🕸 Report date: 24-MAY-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯Thermal release (improper release near to the sticker)
Progress: 60%
Current status: Evaluation on time / temperature. But temperature inconsistant. Will fix the temperature system (today buy off failed)
Due date: 25-May-2016

🎯Install label linear remover assembly
Progress: 10%
Current status: Design concept final stage. Pending fabrication.
Due date: 17-June-2016 (improvement plan-can buy off without this first)


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WAFTECH#3 CU PILLAR UPDATE

🎯UV detaper not effective enough
Progress: 20%
Current status: Hardware designing stage.
Due date: 27 June 2016

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🎯 Today activity:
-Replace Taping 2 to Taping 1 blade holder waftech#01 (Cu SMT). Waftech will change the blade holder material and estimation to arrive on Friday. For Cu Pillar, cant run since it need both blade function.
-Evaluate thermal release on time (no effect). Tomorrow will continue play with temperature time when the temperature system fix.

Note:
Waftech group, pls ensure to attend meeting at 5.30pm every working days.

23-MAY-2016

🕸 Report date: 23-MAY-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯no update for today. Waftech offday.

note: taping 1 blade holder broken during run waftech#1. pls fix asap.

20-MAY-2016

🕸 Report date: 20-MAY-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯Thermal release (improper release near to the sticker)
Progress: 40%
Current status: Still continue to fine tune parameter for the best result (today buy off failed)
Due date: 25-May-2016

🎯Install label linear remover assembly
Progress: 10%
Current status: Design concept final stage. Pending fabrication.
Due date: 17-June-2016 (improvement plan-can buy off without this first)

NEW ISSUE
🎯Sofware bug during cancel job. Msg "Job-Pls remove cassette".
Progress: 0%
Current status: To be highlighted software engineer.
Due Date: 24-May-2016

🎯Software: Incomplete retry sequence - at mounting side
Progress: 0%
Current status: To be highlighted software engineer.
Due Date: 24-May-2016

🎯Software: Carrier eject sequence inter-mitten fail to execute.
Current status: To be highlighted software engineer.
Due Date: 24-May-2016


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WAFTECH#3 CU PILLAR UPDATE

🎯UV detaper not effective enough
Progress: 20%
Current status: Hardware designing stage.
Due date: 27 June 2016

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🎯 Today activity:
-Carrier stack sensor (today failed & today solved)
-Mounting tape preparation inconsistent issue (solved - correct mechanical alignment)
-Thermal release: change sequence mode (part of release quality)(improved but not 100% release - cont' on Monday)

Note: Too much software issue. Can waftech please assign software engineer to have more time here?

19-May-2016

🕸Report date: 19-MAY-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯Thermal release (improper release near to the sticker)
Progress: 25%
Current status: Still fine tune parameter for the best result.
Due date: 25-May-2016

🎯Install label linear remover assembly
Progress: 10%
Current status: Design concept final stage. Pending fabrication.
Due date: 17-June-2016 (improvement plan-can buy off without this first)


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WAFTECH#3 CU PILLAR UPDATE

🎯UV detaper not effective enough
Progress: 20%
Current status: Hardware designing stage.
Due date: 27 June 2016

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🎯 Today activity:
-Software outstanding issue (format font, retry mode)(done)
-Mechanical setting for thermal release (not complete yet)

5TH round jalan waftech

Inspection by firdaus.
Yield - 21/25 =  84%

1 - bubble
2 - OK
3 - OK
4 - BUBBLE tepi
5 - OK
6 - OK
7 - OK
8 - OK
9 - OK
10- OK
11- OK
12- bubble
13- OK
14- OK
15- OK
16- OK
17- OK
18- OK
19- OK
20- OK
21- BUBBLE
22- OK
23- OK
24- OK
25- OK

Cu pillar waftech 1 & 2

Jalan cu pillar 6 keping no issue..

Lepas tu yang cutting tape dok lari tu dah ejas roller guide..

Isnin minggu depan test..