24-MAY-2016

🕸 Report date: 24-MAY-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯Thermal release (improper release near to the sticker)
Progress: 60%
Current status: Evaluation on time / temperature. But temperature inconsistant. Will fix the temperature system (today buy off failed)
Due date: 25-May-2016

🎯Install label linear remover assembly
Progress: 10%
Current status: Design concept final stage. Pending fabrication.
Due date: 17-June-2016 (improvement plan-can buy off without this first)


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WAFTECH#3 CU PILLAR UPDATE

🎯UV detaper not effective enough
Progress: 20%
Current status: Hardware designing stage.
Due date: 27 June 2016

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🎯 Today activity:
-Replace Taping 2 to Taping 1 blade holder waftech#01 (Cu SMT). Waftech will change the blade holder material and estimation to arrive on Friday. For Cu Pillar, cant run since it need both blade function.
-Evaluate thermal release on time (no effect). Tomorrow will continue play with temperature time when the temperature system fix.

Note:
Waftech group, pls ensure to attend meeting at 5.30pm every working days.