19-May-2016

🕸Report date: 19-MAY-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯Thermal release (improper release near to the sticker)
Progress: 25%
Current status: Still fine tune parameter for the best result.
Due date: 25-May-2016

🎯Install label linear remover assembly
Progress: 10%
Current status: Design concept final stage. Pending fabrication.
Due date: 17-June-2016 (improvement plan-can buy off without this first)


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WAFTECH#3 CU PILLAR UPDATE

🎯UV detaper not effective enough
Progress: 20%
Current status: Hardware designing stage.
Due date: 27 June 2016

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🎯 Today activity:
-Software outstanding issue (format font, retry mode)(done)
-Mechanical setting for thermal release (not complete yet)