25-MAY-2016

🕸 Report date: 25-MAY-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯Thermal release (improper release near to the sticker)
Progress: 95%
Current status: Evaluation done. The best result based on UPH & Quality is 150C vs 20sec. Need buy off more wafer.
Due date: 25-May-2016

🎯Install label linear remover assembly
Progress: 10%
Current status: Design concept final stage. Pending fabrication.
Due date: 17-June-2016 (improvement plan-can buy off without this first)

🎯Software: Pick & Place label "recovery mode" if mc fail to place/pick the label.
Progress: 0%
Current status: Facing this problem today during buy off. In progress under software.
Due date: TBA

🎯 Barcode installation &  system server (if fail OCR)
Progress: 10%
Current status: Need to manual key in using key board if OCR fail to read (but still have potiential for wrong input). Recommend Barcode scanner to install in order to ensure no failure (poka yoke)
Current status: Under discussion with waftech group.
Due date: TBA

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WAFTECH#3 CU PILLAR UPDATE

🎯UV detaper not effective enough
Progress: 20%
Current status: Hardware designing stage.
Due date: 27 June 2016

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🎯 Today activity:
-Fix the temperature system & controller
-Optimize the thermal release parameter (temp vs time - 5x5 matrix)
-Loosen the magazine part (too tight)