20-MAY-2016

🕸 Report date: 20-MAY-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯Thermal release (improper release near to the sticker)
Progress: 40%
Current status: Still continue to fine tune parameter for the best result (today buy off failed)
Due date: 25-May-2016

🎯Install label linear remover assembly
Progress: 10%
Current status: Design concept final stage. Pending fabrication.
Due date: 17-June-2016 (improvement plan-can buy off without this first)

NEW ISSUE
🎯Sofware bug during cancel job. Msg "Job-Pls remove cassette".
Progress: 0%
Current status: To be highlighted software engineer.
Due Date: 24-May-2016

🎯Software: Incomplete retry sequence - at mounting side
Progress: 0%
Current status: To be highlighted software engineer.
Due Date: 24-May-2016

🎯Software: Carrier eject sequence inter-mitten fail to execute.
Current status: To be highlighted software engineer.
Due Date: 24-May-2016


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WAFTECH#3 CU PILLAR UPDATE

🎯UV detaper not effective enough
Progress: 20%
Current status: Hardware designing stage.
Due date: 27 June 2016

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🎯 Today activity:
-Carrier stack sensor (today failed & today solved)
-Mounting tape preparation inconsistent issue (solved - correct mechanical alignment)
-Thermal release: change sequence mode (part of release quality)(improved but not 100% release - cont' on Monday)

Note: Too much software issue. Can waftech please assign software engineer to have more time here?