Day 9

Inari attendance:

1. Alif (013-4063267)

2. Lokman Trainee (010-5614518)

Waftech attendance:
1. Chan Jr (018-9449917)
2. Khai (016-5078149)

3. SK Lim (016-4816770)-half day

WAFTECH # 1
Progress:
1. Tape excessive done adjusted the position, program by SK Lim (solved)

3. Convert carrier to laminate process (done)
3. Observed tape delamination. CA: Tune the tape to 5.5cm (between two wafer).(solved)

4. After have a good result from 5 times carrier test, try run 25 wafers. Wafer 1 to 5 having no problem, but starting from wafer no 6, the cutting start to offset on the both flat notch. (new pending)

5. No bubble detected during test run 25 wafer. (done)

 

WAFTECH # 2
Progress:

1. Turn ON back waftech#2 for Cu Pad. Detected the roller on peel side does not work due to program setting issue. Awaiting CS Kang to re-program (new pending).

2.  Add on shim on stopper at carrier-wafer attach side. No alignment issue. (done)

 

WAFTECH # 3
Progress:
Idle. No Man Power.

 

Old Pending:
1. Solution for - glass carrier detection error at aligner.-8 days ago
2. Robot arm hit the aligner and caused robot arm bent. Waftech dismantle the robot arm and bring it back to waftech's office -3 days ago