Inari attendance:
1. Alif (013-4063267)
Waftech attendance: (half day)
1. Chan Jr (018-9449917)
2. Khai (016-5078149)
WAFTECH # 1
Progress:
NA.
Old Pending:
1. New program (offset cutting issue) from Dr Yu (conduct by Waftech)
WAFTECH # 3
Progress:
1. Corrrelate thermal release temperature to the actual temperature on surface chuck table (130C). Before this set 150 but the actual is 120. (solved)
2. Align the wafer to accurate position by offset 2 degree.(solved)
3. Software detected have bug, not wafer loading not follow the sequence, only run 1 wafer then stop. (new pending)
4. Do correction on mounter chuck table (before this wrong position). (solved)
5. Continue testing for thermal release after correlation.(new pending)
Old Pending:
1. Solution for - Wafer placement error at aligner. (suggestion: robot arm release the wafer first, then aligner vacuum will suck the wafer instead of aligner suck the wafer first then robot arm release the wafer).-1 day ago
2. Solution for - glass carrier detection error at aligner.-1 day ago
3. Solution for - Vacuum holder stuck to the carrier+thermal tape after thermal release. NPI side no issue since carrier only will be removed. (suggestion: put blower to blow the carrier+thermal tape) -1 day ago
1. Alif (013-4063267)
Waftech attendance: (half day)
1. Chan Jr (018-9449917)
2. Khai (016-5078149)
WAFTECH # 1
Progress:
NA.
Old Pending:
1. New program (offset cutting issue) from Dr Yu (conduct by Waftech)
WAFTECH # 3
Progress:
1. Corrrelate thermal release temperature to the actual temperature on surface chuck table (130C). Before this set 150 but the actual is 120. (solved)
2. Align the wafer to accurate position by offset 2 degree.(solved)
3. Software detected have bug, not wafer loading not follow the sequence, only run 1 wafer then stop. (new pending)
4. Do correction on mounter chuck table (before this wrong position). (solved)
5. Continue testing for thermal release after correlation.(new pending)
Old Pending:
1. Solution for - Wafer placement error at aligner. (suggestion: robot arm release the wafer first, then aligner vacuum will suck the wafer instead of aligner suck the wafer first then robot arm release the wafer).-1 day ago
2. Solution for - glass carrier detection error at aligner.-1 day ago
3. Solution for - Vacuum holder stuck to the carrier+thermal tape after thermal release. NPI side no issue since carrier only will be removed. (suggestion: put blower to blow the carrier+thermal tape) -1 day ago
 |
| Correct position for chuck mounter |
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