Day 2

Inari attendance:
1. Alif (013-4063267)
2. Lokman Trainee (010-5614518)

Waftech attendance:
1. Chan Jr (018-9449917)
2. Khai (016-5078149)


WAFTECH # 1
Progress:
1. Bubble solve-by lower down the height of chuck table (remove 1 out of 3 shim).(solved)
2. Cu Piller using 3 shim, Production Carrier using 2 shim. Every conversion need to adjust the shim.
3. Cutting offset -  waftech stated they will contact Dr yee from China to adjust the program. Expectation date will be informed later by Waftech. (new pending)

No bubble

Remove shim

Excessive tape-need improve the program

WAFTECH # 3
Progress:
1. Vacuum holder stuck to the carrier+thermal tape after thermal release. NPI side no issue since carrier only will be removed.(new pending)
2. Glass carrier still cannot align. Awaiting solution from Waftech.(new pending)
3. Robort arm need manual touch then the wafer will placed at the aligner. Wafer placement error at aligner. (new pending)
4. Improper release on thermal release. Refer below photo. Bypass thermostat and will continue the progress tomorrow.(new pending)

Improper release