23-MAY-2016

🕸 Report date: 23-MAY-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯no update for today. Waftech offday.

note: taping 1 blade holder broken during run waftech#1. pls fix asap.

20-MAY-2016

🕸 Report date: 20-MAY-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯Thermal release (improper release near to the sticker)
Progress: 40%
Current status: Still continue to fine tune parameter for the best result (today buy off failed)
Due date: 25-May-2016

🎯Install label linear remover assembly
Progress: 10%
Current status: Design concept final stage. Pending fabrication.
Due date: 17-June-2016 (improvement plan-can buy off without this first)

NEW ISSUE
🎯Sofware bug during cancel job. Msg "Job-Pls remove cassette".
Progress: 0%
Current status: To be highlighted software engineer.
Due Date: 24-May-2016

🎯Software: Incomplete retry sequence - at mounting side
Progress: 0%
Current status: To be highlighted software engineer.
Due Date: 24-May-2016

🎯Software: Carrier eject sequence inter-mitten fail to execute.
Current status: To be highlighted software engineer.
Due Date: 24-May-2016


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WAFTECH#3 CU PILLAR UPDATE

🎯UV detaper not effective enough
Progress: 20%
Current status: Hardware designing stage.
Due date: 27 June 2016

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🎯 Today activity:
-Carrier stack sensor (today failed & today solved)
-Mounting tape preparation inconsistent issue (solved - correct mechanical alignment)
-Thermal release: change sequence mode (part of release quality)(improved but not 100% release - cont' on Monday)

Note: Too much software issue. Can waftech please assign software engineer to have more time here?

19-May-2016

🕸Report date: 19-MAY-2016🕸
WAFTECH#3 CU SMT UPDATE

🎯Thermal release (improper release near to the sticker)
Progress: 25%
Current status: Still fine tune parameter for the best result.
Due date: 25-May-2016

🎯Install label linear remover assembly
Progress: 10%
Current status: Design concept final stage. Pending fabrication.
Due date: 17-June-2016 (improvement plan-can buy off without this first)


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WAFTECH#3 CU PILLAR UPDATE

🎯UV detaper not effective enough
Progress: 20%
Current status: Hardware designing stage.
Due date: 27 June 2016

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🎯 Today activity:
-Software outstanding issue (format font, retry mode)(done)
-Mechanical setting for thermal release (not complete yet)

5TH round jalan waftech

Inspection by firdaus.
Yield - 21/25 =  84%

1 - bubble
2 - OK
3 - OK
4 - BUBBLE tepi
5 - OK
6 - OK
7 - OK
8 - OK
9 - OK
10- OK
11- OK
12- bubble
13- OK
14- OK
15- OK
16- OK
17- OK
18- OK
19- OK
20- OK
21- BUBBLE
22- OK
23- OK
24- OK
25- OK

Cu pillar waftech 1 & 2

Jalan cu pillar 6 keping no issue..

Lepas tu yang cutting tape dok lari tu dah ejas roller guide..

Isnin minggu depan test..

4th round jalan

9 bubble
1 - excessive tape
15 ok

3rd round jalan waftech 1

Kali ketiga mesin ada some bug on software. Machine hang.
Error: Robot presence error