Day 11

Off Day

Day 10

Off Day

Day 9

Inari attendance:

1. Alif (013-4063267)

2. Lokman Trainee (010-5614518)

Waftech attendance:
1. Chan Jr (018-9449917)
2. Khai (016-5078149)

3. SK Lim (016-4816770)-half day

WAFTECH # 1
Progress:
1. Tape excessive done adjusted the position, program by SK Lim (solved)

3. Convert carrier to laminate process (done)
3. Observed tape delamination. CA: Tune the tape to 5.5cm (between two wafer).(solved)

4. After have a good result from 5 times carrier test, try run 25 wafers. Wafer 1 to 5 having no problem, but starting from wafer no 6, the cutting start to offset on the both flat notch. (new pending)

5. No bubble detected during test run 25 wafer. (done)

 

WAFTECH # 2
Progress:

1. Turn ON back waftech#2 for Cu Pad. Detected the roller on peel side does not work due to program setting issue. Awaiting CS Kang to re-program (new pending).

2.  Add on shim on stopper at carrier-wafer attach side. No alignment issue. (done)

 

WAFTECH # 3
Progress:
Idle. No Man Power.

 

Old Pending:
1. Solution for - glass carrier detection error at aligner.-8 days ago
2. Robot arm hit the aligner and caused robot arm bent. Waftech dismantle the robot arm and bring it back to waftech's office -3 days ago  

Day 8

Inari attendance:
1. Alif (013-4063267)

Waftech attendance:
1. Chan Jr (018-9449917)
2. Khai (016-5078149) -half day

WAFTECH # 1
Progress:
Idle
Meeting with BS Teoh to change from carrier laminate to wafer laminate

Old Pending:
1.  New program (offset cutting issue) from Dr Yu (conduct by Waftech) -5 days ago


WAFTECH # 3
Progress:
1. Pincher not fully release the SPV-214 tape residue (solved)
 
Old Pending:
1. Solution for - glass carrier detection error at aligner.-7 days ago
2. Robot arm hit the aligner and caused robot arm bent. Waftech dismantle the robot arm and bring it back to waftech's office -2 days ago

Day 7

Inari attendance:
1. Alif (013-4063267)

Waftech attendance:
1. Chan Jr (018-9449917)
2. Khai (016-5078149)

WAFTECH # 1
Progress:
Idle

Old Pending:
1.  New program (offset cutting issue) from Dr Yu (conduct by Waftech) -4 days ago


WAFTECH # 3
Progress:
1. Verify software correction (solved)
3. Verify Mis-alignment on thermal release table. (solved) 
3. Pincher not fully release the SPV-214 tape residue (new pending)
 

Old Pending:
1. Solution for - glass carrier detection error at aligner.-6 days ago
2. Robot arm hit the aligner and caused robot arm bent. Waftech dismantle the robot arm and bring it back to waftech's office -1 day ago

Day 6

Inari attendance:
1. Alif (013-4063267)

Waftech attendance:
1. Chan Jr (018-9449917)
2. Khai (016-5078149)
3. CS Kang (016-4384807)

WAFTECH # 1
Progress:
Send email to BS Teoh last report (wafer laminate report).

Old Pending:
1.  New program (offset cutting issue) from Dr Yu (conduct by Waftech) -3 days ago


WAFTECH # 3
Progress:
1. Software bug solved by CS Kang (solved-pending verification)
2. Robot arm hit the aligner and caused robot arm bent. Waftech dismantle the robot arm and bring it back to waftech's office (new pending)
3. Mis-alignment on thermal release table. (new problem detected and solved-pending verification) 
4.  Solution for - Vacuum holder stuck to the carrier+thermal tape after thermal release. NPI side no issue since carrier only will be removed. (solved)


Old Pending:
1. Solution for - glass carrier detection error at aligner.-5 days ago

robot arm bent

 

Day 5

Inari attendance:
1. Alif (013-4063267)

Waftech attendance:
1. Chan Jr (018-9449917)
2. Khai (016-5078149)

WAFTECH # 1
Progress:
NA.

Old Pending:
1.  New program (offset cutting issue) from Dr Yu (conduct by Waftech) -2 days ago


WAFTECH # 3
Progress:
1. Wafer placement error at aligner (solved)
2.  Software keep trigger error EXCEPTION - RESET NOT ALLOW until end of the day. Awaiting CS Kang to solve tomorrow.(new pending)


Old Pending:
1. Solution for - glass carrier detection error at aligner.-4 days ago
2. Solution for - Vacuum holder stuck to the carrier+thermal tape after thermal release. NPI side no issue since carrier only will be removed. (suggestion: put blower to blow the carrier+thermal tape) -3 days ago
3. Software detected have bug, not wafer loading not follow the sequence, only run 1 wafer then stop. 1 day ago 
4.  Continue testing for thermal release after correlation.1 day ago